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| Keyword : HEMT
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InP HEMT Technology for High-Speed Logic and Communications
Tetsuya SUEMITSU Masami TOKUMITSU | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2007/05/01
Vol. E90-C
No. 5 ;
pp. 917-922
Type of Manuscript:
Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category: Compound Semiconductor and Power Devices
Keyword:
HEMT, InP, cutoff frequency, OEIC, | | | Summary | Full Text:PDF | |
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High Power GaN-HEMT for Wireless Base Station Applications
Toshihide KIKKAWA Kazukiyo JOSHIN | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2006/05/01
Vol. E89-C
No. 5 ;
pp. 608-615
Type of Manuscript:
Special Section PAPER (Special Section on Fundamental and Application of Advanced Semiconductor Devices)
Category: Compound Semiconductor Devices
Keyword:
GaN, HEMT, base station, amplifier, W-CDMA, | | | Summary | Full Text:PDF | |
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A V-band Monolithic HEMT Amplifier Using Two Types of RF Grounds
Naoko ONO | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2004/06/01
Vol. E87-C
No. 6 ;
pp. 1010-1012
Type of Manuscript:
Special Section LETTER (Special Section on Analog Circuit and Device Technologies)
Category:
Keyword:
RF ground, HEMT, coplanar waveguide, amplifier, V-band, | | | Summary | Full Text:PDF | |
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InP-Based Lightwave Communication ICs for 40 Gbit/s and Beyond
Eiichi SANO Yasuro YAMANE | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C
No. 11 ;
pp. 1879-1885
Type of Manuscript:
INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: Information and Communication System
Keyword:
InP, HEMT, analog IC, digital IC, packaging, | | | Summary | Full Text:PDF | |
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Design of a K-Band Power Amplifier Using On-Wafer-Tuning Load-Pull Method
Minoru IDA Masashi NAKATSUGAWA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C
No. 6 ;
pp. 882-885
Type of Manuscript:
Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Semiconductor Devices and Amplifiers
Keyword:
power amplifier, load-pull measurement, on-wafer, MMIC, HEMT, | | | Summary | Full Text:PDF | |
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N-InAlAs/InGaAs HEMT DCFL Inverter Fabricated Using Pt-Based Gate and Photochemical Dry Etching
Naoki HARADA Shigeru KURODA Kohki HIKOSAKA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1992/10/25
Vol. E75-C
No. 10 ;
pp. 1165-1171
Type of Manuscript:
Special Section PAPER (Special Issue on Compound Semiconductor Integrated Circuits)
Category:
Keyword:
HEMT, InGaAs, Schottky junction, DCEL, dry etching, | | | Summary | Full Text:PDF | |
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