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High Density Front-End Technologies for RF ATE with Multiple Resources and High Throughput Testing Masayuki KIMISHIMA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2026/10/01
Vol. E109-C
No. 10 ;
pp. 382-389
Type of Manuscript:
INVITED PAPER (Special Section on Microwave and Millimeter-Wave Technologies)
Category: Keyword: RF test, ATE, SIP, RF-IC, LTCC, ΔΣ modulator, MMIC, | | | Summary | Full Text:PDF | |
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Introduction to Latest RF ATE with Low Test Cost Solutions Masayuki KIMISHIMA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C
No. 7 ;
pp. 1147-1153
Type of Manuscript:
INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
Category: Keyword: ATE, SoC tester, SIP, calibration, LTCC, MMIC, | | | Summary | Full Text:PDF | |
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