Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1992/09/25 Vol. E75-CNo. 9 ;
pp. 1043-1048 Type of Manuscript: Special Section PAPER (Special Issue on Silicon Devices and Materials) Category: Keyword: SOI, wafer bonding, void, laser/microwave method, lifetime,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1992/09/25 Vol. E75-CNo. 9 ;
pp. 1049-1055 Type of Manuscript: Special Section PAPER (Special Issue on Silicon Devices and Materials) Category: Keyword: bonding SOI, DLTS, thermal donor, C-V, void,