Takahisa NAKAI


Characterization of a Silicon Wafer after the Removal of Photoresist Layer Using Two Lasers of Different Wavelengths
Akira USAMI Hideki FUJIWARA Takahisa NAKAI Kazunori MATSUKI Tsutomu TAKEUCHI Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9  pp. 978-985
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
lifetimeSRMIimpedance mismatchingR-SRMI
 Summary | Full Text:PDF

Contactless Evaluation Using a Laser/Microwave Method for the Silicon-on-Insulator Made by Wafer Bonding
Akira USAMI Takahisa NAKAI Hideki FUJIWARA Shun-ichiro ISHIGAMI Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9  pp. 1043-1048
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
SOIwafer bondingvoidlaser/microwave methodlifetime
 Summary | Full Text:PDF