Keyword : wafer bonding


SMART-CUT(R): The Basic Fabrication Process for UNIBOND(R) SOI Wafers
A.J. AUBERTON-HERVE Michel BRUEL Bernard ASPAR Christophe MALEVILLE Hubert MORICEAU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/03/25
Vol. E80-C  No. 3 ; pp. 358-363
Type of Manuscript:  INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies)
Category: Wafer Technologies
Keyword: 
SOIUNIBOND(R)Smart-Cut(R)wafer bonding
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Thinned Silicon Layers on Oxide Film, Quartz and Sapphire by Wafer Bonding
Takao ABE Yasuyuki NAKAZATO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/03/25
Vol. E77-C  No. 3 ; pp. 342-349
Type of Manuscript:  INVITED PAPER (Special Issue on Quarter Micron Si Device and Process Technologies)
Category: 
Keyword: 
SOISi on quartzSOSwafer bondingdislocation-freesilicon layer
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High-Speed SOI Bipolar Transistors Using Bonding and Thinning Techniques
Manabu KOJIMA Atsushi FUKURODA Tetsu FUKANO Naoshi HIGAKI Tatsuya YAMAZAKI Toshihiro SUGII Yoshihiro ARIMOTO Takashi ITO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/04/25
Vol. E76-C  No. 4 ; pp. 572-576
Type of Manuscript:  Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies)
Category: Device Technology
Keyword: 
SOI bipolar transistorsthin buried layerwafer bondingselective polishing
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C-V Measurement and Simulation of Silicon-Insulator-Silicon (SIS) Structures for Analyzing Charges in Buried Oxides of Bonded SOI Materials
Kiyoshi MITANI Hisham Z. MASSOUD 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/12/25
Vol. E75-C  No. 12 ; pp. 1421-1429
Type of Manuscript:  Special Section PAPER (Special Issue on SOI (Si on Insulator) Devices)
Category: SOI Wafers
Keyword: 
silicon-insulator-silicon (SIS) structureC-V simulationnegative chargecharge distributionbonding seamwafer bonding
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Bonded SOI with Polish-Stopper Technology for ULSI
Yoshihiro MIYAZAWA Makoto HASHIMOTO Naoki NAGASHIMA Hiroshi SATO Muneharu SHIMANOE Katsunori SENO Fumio MIYAJI Takeshi MATSUSHITA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/12/25
Vol. E75-C  No. 12 ; pp. 1522-1528
Type of Manuscript:  Special Section PAPER (Special Issue on SOI (Si on Insulator) Devices)
Category: SOI LSIs
Keyword: 
SOIwafer bondingpolish-stopper256 kb SRAM 4 Mb SRAM cell
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Contactless Evaluation Using a Laser/Microwave Method for the Silicon-on-Insulator Made by Wafer Bonding
Akira USAMI Takahisa NAKAI Hideki FUJIWARA Shun-ichiro ISHIGAMI Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9 ; pp. 1043-1048
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
SOIwafer bondingvoidlaser/microwave methodlifetime
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