Shun-ichiro ISHIGAMI


Contactless Evaluation Using a Laser/Microwave Method for the Silicon-on-Insulator Made by Wafer Bonding
Akira USAMI Takahisa NAKAI Hideki FUJIWARA Shun-ichiro ISHIGAMI Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9  pp. 1043-1048
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
SOIwafer bondingvoidlaser/microwave methodlifetime
 Summary | Full Text:PDF

Evaluation of Bonding Silicon-on-Insulator Films with Deep-Level Transient Spectroscopy Measurements
Akira USAMI Taichi NATORI Akira ITO Shun-ichiro ISHIGAMI Yutaka TOKUDA Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9  pp. 1049-1055
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
bonding SOIDLTSthermal donorC-Vvoid
 Summary | Full Text:PDF