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IEICE Trans

Keyword : laser/microwave method

Contactless Evaluation Using a Laser/Microwave Method for the Silicon-on-Insulator Made by Wafer Bonding
Akira USAMI Takahisa NAKAI Hideki FUJIWARA Shun-ichiro ISHIGAMI Takao WADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Vol. E75-C  No. 9 ; pp. 1043-1048
Type of Manuscript:  Special Section PAPER (Special Issue on Silicon Devices and Materials)
Category: 
Keyword: 
SOI, wafer bonding, void, laser/microwave method, lifetime, 
 Summary | Full Text:PDF