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Vol.E82-C No.11
pp.1992-1999
Special SectionPAPER
Low Power-Consumption RF ICs
ECL-Compatible Low-Power-Consumption 10-Gb/s GaAs 8:1 Multiplexer and 1:8 Demultiplexer
Nobuhide YOSHIDA, Masahiro FUJII, Takao ATSUMO, Keiichi NUMATA, Shuji ASAI, Michihisa KOHNO, Hirokazu OIKAWA, Hiroaki TSUTSUI, Tadashi MAEDA, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2000-2006
Special SectionPAPER
Low Power-Consumption RF ICs
High-Speed, Low-Power Lightwave Communication ICs Using InP/InGaAs Double-Heterojunction Bipolar Transistors
Eiichi SANO, Kenji KURISHIMA, Hiroki NAKAJIMA, Shoji YAMAHATA, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2007-2012
Special SectionPAPER
Low Power-Consumption RF ICs
High-Frequency, Low-Noise Si Bipolar Transistor Fabricated Using Self-Aligned Metal/IDP Technology
Hiromi SHIMAMOTO, Takahiro ONAI, Eiji OHUE, Masamichi TANABE, Katsuyoshi WASHIO, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2013-2020
Special SectionPAPER
Low Power-Consumption RF ICs
DC and AC Performances in Selectively Grown SiGe-Base HBTs
Katsuya ODA, Eiji OHUE, Masamichi TANABE, Hiromi SHIMAMOTO, Katsuyoshi WASHIO, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2021-2028
INVITED PAPER
RF Assembly Technology
Innovative Packaging and Fabrication Concept for a 28 GHz Communication Front-End
Wolfgang MENZEL, Jurgen KASSNER, Uhland GOEBEL, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2029-2037
INVITED PAPER
RF Assembly Technology
Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI, Hiroshi OGURA, Morikazu SAGAWA, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2038-2043
Special SectionPAPER
RF Assembly Technology
Millimeter-Wave Flip-Chip MMIC Structure with High Performance and High Reliability Interconnects
Masaharu ITO, Kenichi MARUHASHI, Hideki KUSAMITSU, Yoshiaki MORISHITA, Keiichi OHATA, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2044-2049
Special SectionPAPER
RF Assembly Technology
A Compact Plastic Package with High RF Isolation by Subsidiary Inner Ground Leads
Hidetoshi ISHIDA, Kazuo MIYATSUJI, Tsuyoshi TANAKA, Daisuke UEDA, Chihiro HAMAGUCHI, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2050-2055
Special SectionPAPER
RF Assembly Technology
Very-Thin, Light-Weight Opto and Microwave Receiver Module for Satellite Communications
Kazuhiko NAKAHARA, Shinichi KANEKO, Yasushi ITOH, |
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Summary | Full Text:PDF | |
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Vol.E82-C No.11
pp.2056-2064
PAPER
Integrated Electronics
Current-Sensed SRAM Techniques for Megabit-Class Integration--Progress in Operating Frequency by Using Hidden Writing-Recovery Architecture--
Nobutaro SHIBATA, |
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Summary | Full Text:PDF | |
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