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IEICE Trans

Yuzo ISHII

Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA Yuzo ISHII Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2  pp. 297-302
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bonding, surface activated bonding, assembly, micro-system, integration, MEMS, micromachine, WWW, 
 Summary | Full Text:PDF