Keyword : micro-system


Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA Yuzo ISHII Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2 ; pp. 297-302
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bondingsurface activated bondingassemblymicro-systemintegrationMEMSmicromachineWWW
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