Keyword : bonding

Reduction of Access Resistance of InP/InGaAs Composite-Channel MOSFET with Back-Source Electrode
Atsushi KATO Toru KANAZAWA Shunsuke IKEDA Yoshiharu YONAI Yasuyuki MIYAMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/05/01
Vol. E95-C  No. 5 ; pp. 904-909
Type of Manuscript:  Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category: 
Keyword: 
back-source, MOSFET, InGaAs, BCB, bonding, 
 Summary | Full Text:PDF
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA Yuzo ISHII Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2 ; pp. 297-302
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bonding, surface activated bonding, assembly, micro-system, integration, MEMS, micromachine, WWW, 
 Summary | Full Text:PDF