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IEICE Trans

Ingrid De WOLF

Stress Engineering in Si Based Micro Structures Using Technology Computer-Aided Design
Vincent SENEZ Aldo ARMIGLIATO Giovanni CARLOTTI Gianpietro CARNEVALE Herve JAOUEN Ingrid De WOLF 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/03/01
Vol. E86-C  No. 3  pp. 284-294
Type of Manuscript:  INVITED PAPER (Special Issue on the 2002 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'02))
Category: 
Keyword: 
modeling, stresses, finite element, silicon technologies, front/back end of line, 
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