Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2003/03/01 Vol. E86-CNo. 3pp. 284-294 Type of Manuscript: INVITED PAPER (Special Issue on the 2002 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'02)) Category: Keyword: modeling, stresses, finite element, silicon technologies, front/back end of line,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2000/08/25 Vol. E83-CNo. 8pp. 1267-1274 Type of Manuscript: Special Section PAPER (Special Issue on 1999 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'99)) Category: Process Modeling and Simulation Keyword: diffusion, finite element, three-dimensional, gear scheme, point-defects, silicon,