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IEICE Trans

Keyword : 3D package

The Dawn of 3D Packaging as System-in-Package (SIP)
Morihiro KADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1763-1770
Type of Manuscript:  INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
3D package, SIP, CSP, stacked CSP, cellular phone, 
 Summary | Full Text:PDF