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The Dawn of 3D Packaging as System-in-Package (SIP)
Morihiro KADA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C
No. 12 ;
pp. 1763-1770
Type of Manuscript:
INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category:
Keyword:
3D package, SIP, CSP, stacked CSP, cellular phone, | | | Summary | Full Text:PDF | |
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