| Keyword : stacked CSP
|
The Dawn of 3D Packaging as System-in-Package (SIP) Morihiro KADA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C
No. 12 ;
pp. 1763-1770
Type of Manuscript:
INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: Keyword: 3D package, SIP, CSP, stacked CSP, cellular phone, | | Summary | Full Text:PDF | |
|
|