The Dawn of 3D Packaging as System-in-Package (SIP)

Morihiro KADA  

IEICE TRANSACTIONS on Electronics   Vol.E84-C   No.12   pp.1763-1770
Publication Date: 2001/12/01
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
3D package,  SIP,  CSP,  stacked CSP,  cellular phone,  

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The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the forerunner from which 3D system packages realize full-scale capability. In the future, 3D package technology will act as a savior in achieving greater shrink of silicon processes--whose limits have come into sight. As SIP, it will surpass SOC, and, as the core technology of electronic equipment for our high-speed digital network society, it is expected to lead the way into the first period of the 21st century. Today, we are seeing the signs of this transition.