Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2014/12/01 Vol. E97-ANo. 12 ;
pp. 2373-2382 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Device and Circuit Modeling and Analysis Keyword: Edge-over-Erosion, CMP, manufacturability, machine learning,
Publication: IEICE TRANSACTIONS on Communications Publication Date: 2007/12/01 Vol. E90-BNo. 12 ;
pp. 3748-3751 Type of Manuscript: LETTER Category: Multimedia Systems for Communications Keyword: IEEE 1394 over UWB, IEEE 1394, IEEE 1394.1, CMP, bridge, HDTV, home-networking,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2005/12/01 Vol. E88-ANo. 12 ;
pp. 3471-3478 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Interconnect Keyword: dummy metal, dummy fill, interconnect capacitance, CMP,