Wei Fong CHANG

Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills
Atsushi KUROKAWA Toshiki KANAMOTO Tetsuya IBE Akira KASEBE Wei Fong CHANG  Tetsuro KAGE Yasuaki INOUE Hiroo MASUDA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Vol. E88-A  No. 12  pp. 3471-3478
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Interconnect
dummy metaldummy fillinterconnect capacitanceCMP
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