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FOREWORD
Masato MOTOMURA | Publication: IEICE TRANSACTIONS on Information and Systems
Publication Date: 2019/05/01
Vol. E102-D
No. 5
pp. 1002-1002
Type of Manuscript:
FOREWORD
Category:
Keyword:
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Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration
Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C
No. 4
pp. 288-297
Type of Manuscript:
Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
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Keyword:
TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, | | | Summary | Full Text:PDF | |
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Cache-Processor Coupling: A Fast and Wide On-Chip Data Cache Design
Masato MOTOMURA Toshiaki INOUE Hachiro YAMADA Akihiko KONAGAYA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1995/06/25
Vol. E78-C
No. 6
pp. 623-630
Type of Manuscript:
Special Section PAPER (Special Issue on the 1994 VLSI Circuits Symposium (Joint Issue with the IEEE Journal of Solid-State Circuits, Vol. 30, No. 4 April 1995))
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