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Vol.E74-C No.8
pp.2323-2330
Special SectionPAPER
Multi Chip Module
A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package
Toshio SUDO, Susumu KIMIJIMA, Osamu SHIMADA, Nobuo IWASE, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2331-2336
Special SectionPAPER
Packaging Technology for Main Frame
High Performance Packaging Technology for Supercomputers
Toshihiko WATARI, Akihiro DOHYA, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2337-2343
Special SectionPAPER
Packaging Technology for Main Frame
LSI Packaging Technology for Mainframe Computers
Kenji TAKEDA, Masahide HARADA, Tsuyoshi FUJITA, Takashi INOUE, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2344-2348
Special SectionPAPER
Interconnection
A New Multilayer Ceramic-Frame Package for High-Frequency MMIC Modules
Fuminori ISHITSUKA, Nobuo SATO, Haruhiko KATO, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2349-2354
Special SectionPAPER
Interconnection
Thin Package of LSI by Transferred Bump TAB Technology
Tetsuo KAWAKITA, Kenzo HATADA, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2355-2361
Special SectionPAPER
Interconnection
A Subminiature CCD Module Using a New Assembly Technique
You KONDOH, Masayuki SAITO, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2362-2368
Special SectionPAPER
Interconnection
Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen
Kaoru HASHIMOTO, Masayuki OCHIAI, Kazuaki KARASAWA, Teru NAKANISHI, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2369-2377
Special SectionPAPER
Manufacturing Technology
Development of Ultra Fine Wire and Fine Pitch Bonding Technology
Toshimitsu YAMASHITA, Takashi KANAMORI, Yasuo IGUCHI, Yoshinori ARAO, Susumu SHIBATA, Yasuhide OHNO, Yoshio OHZEKI, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2378-2383
Special SectionPAPER
Manufacturing Technology
Rheology and Printability of Solder Paste
Shigeyuki OGATA, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2384-2389
PAPER
Vacuum and Beam Technologies
Data Compaction and Expansion Method for an Electron Beam Direct Writing System Using a Variably Shaped Line Beam
Takayuki ABE, Mineo GOTO, Ryoichi YOSHIKAWA, Susumu WATANABE, Tadahiro TAKIGAWA, |
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Summary | Full Text:PDF | |
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