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Vol.E74-B No.8
pp.2247-2257
Special SectionPAPER
π/4-CTPSK: A New Modem Technique for Mobile Satellite Radio Systems
Dileeka SUBASHINGHE-DIAS, Kamilo FEHER, |
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Summary | Full Text:PDF | |
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Vol.E74-B No.8
pp.2258-2267
Special SectionPAPER
A Novel Phase Synchronization Method to Cope with a Short-Term Frequency Variation for Preambleless Demodulation
Yoshio TAKEUCHI, Teruhiko HONDA, |
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Summary | Full Text:PDF | |
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Vol.E74-B No.8
pp.2268-2275
PAPER
Switching and Communication Processing
620-Mb/s Circuit-Switching Network Equipment Implementation and Evaluation
Kazuhiro HIRAIDE, Yoshihiro OTSUKA, Kenjiro MURAKAMI, |
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Summary | Full Text:PDF | |
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Vol.E74-B No.8
pp.2276-2283
PAPER
Communication Terminal and Equipment
Frequency Bin Adaptive Filtering (FBAF) Algorithm and Its Application to Acoustic Echo Cancelling
Mohammad Reza ASHARIF, Fumio AMANO, |
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Summary | Full Text:PDF | |
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Vol.E74-B No.8
pp.2284-2287
LETTER
Communication Systems and Transmission Equipment
Flexibilities of Multiplexing Architecture for PCM Transmission Systems
Yutaka KURAHASHI, Takeo MURATA, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2295-2296
FOREWORD
FOREWORD
Kuniaki TANAKA, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2297-2300
INVITED PAPER
High Density Packaging Technology Trend in Japan
Fumio MIYASHIRO, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2301-2308
Special SectionPAPER
Multi Chip Module
1.8-Gb/s High-Speed Multichip Switching Module Using Copper-Polyimide Multilayer Substrate
Naoaki YAMANAKA, Takaaki OHSAKI, Shiro KIKUCHI, Taichi KON, Shinichi SASAKI, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2309-2316
Special SectionPAPER
Multi Chip Module
GaAs Multichip Package for Supercomputer
Kazuhiko UMEZAWA, Tukasa MIZUNO, Hideki NISHIMORI, |
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Summary | Full Text:PDF | |
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Vol.E74-C No.8
pp.2317-2322
Special SectionPAPER
Multi Chip Module
Packaging Technology for HEMT LSI Devices Operated in Liquid Nitrogen
Shigenori AOKI, Yoshihiko IMANAKA, Kishio YOKOUCHI, Nobuo KAMEHARA, |
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Summary | Full Text:PDF | |
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Current List: 41571 - 41580
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