Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1993/04/25
Vol. E76-C
No. 4 ;
pp. 572-576
Type of Manuscript:
Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies)
Category: Device Technology
Keyword:
SOI bipolar transistors, thin buried layer, wafer bonding, selective polishing, |