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IEICE Trans

Keyword : 3-D Integration

Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network
Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C  No. 4 ; pp. 322-332
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
TCI, Coupled-resonator, 3-D Integration, 3-D clock distribution, CDR, 
 Summary | Full Text:PDF