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IEICE Trans

Keyword : incremental floorplanning

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation
Yuchun MA Xin LI Yu WANG Xianlong HONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A  No. 12 ; pp. 2979-2989
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword: 
3D ICs, incremental floorplanning, thermal, MILP, 
 Summary | Full Text:PDF