Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A
No. 12 ;
pp. 2979-2989
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword:
3D ICs, incremental floorplanning, thermal, MILP, |