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| Keyword : coupling
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Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages
Takeshi YUASA Tamotsu NISHINO Hideyuki OH-HASHI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2005/07/01
Vol. E88-C
No. 7 ;
pp. 1401-1405
Type of Manuscript:
Special Section PAPER (Special Section on Recent Technologies of Microwave and Millimeter-Wave Devices Focusing on Miniaturization and Advancement in Performance with Their Applications)
Category: Passive Circuits
Keyword:
multi-layered package, via-hole, coupling, mode-matching technique, | | | Summary | Full Text:PDF | |
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Evaluation of Emission from a PCB by Using Crosstalk between a Low Frequency Signal Trace and a Digital Signal Trace
Naoto OKA Chiharu MIYAZAKI Shuichi NITTA | Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2000/03/25
Vol. E83-B
No. 3 ;
pp. 586-592
Type of Manuscript:
Special Section PAPER (Special Issue on Recent Progress in Electromagnetic Compatibility Technology)
Category: EMC Design of PCB
Keyword:
EMI, radiated emission, printed circuit board, coupling, crosstalk, | | | Summary | Full Text:PDF | |
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