Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2015/12/01 Vol. E98-ANo. 12 ;
pp. 2614-2624 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Device and Circuit Modeling and Analysis Keyword: 3-D IC, delay, through silicon via, sensitivity analysis,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2015/12/01 Vol. E98-ANo. 12 ;
pp. 2584-2591 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Physical Level Design Keyword: TCI, ThruChip, 3-D IC, TSV, inductive coupling interface,