Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2012/12/01
Vol. E95-A
No. 12
pp. 2284-2291
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Device and Circuit Modeling and Analysis Keyword: LSI chip-package-board co-design, electromagnetic compatibility, power supply noise, power delivery network, |