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IEICE Trans

Yoshihiko ASAI

Accurate Modeling Method for Cu Interconnect
Kenta YAMADA Hiroshi KITAHARA Yoshihiko ASAI Hideo SAKAMOTO Norio OKADA Makoto YASUDA Noriaki ODA Michio SAKURAI Masayuki HIROI Toshiyuki TAKEWAKI Sadayuki OHNISHI Manabu IGUCHI Hiroyasu MINDA Mieko SUZUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/06/01
Vol. E91-C  No. 6  pp. 968-977
Type of Manuscript:  PAPER
Category: Semiconductor Materials and Devices
Keyword: 
Cu, interconnect, cross-section, modeling, 
 Summary | Full Text:PDF