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IEICE Trans

Yae OKUNO

Direct Wafer Bonding Technique Aiming for Free-Material and Free-Orientation Integration of Semiconductor Materials
Yae OKUNO Kazuhisa UOMI Masahiro AOKI Tomonobu TSUCHIYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/05/25
Vol. E80-C  No. 5  pp. 682-688
Type of Manuscript:  Special Section PAPER (Special Issue on Photonic Integrated Circuits)
Category: 
Keyword: 
direct wafer bonding, free-material and free-orientation integration, lattice- and orientation-mismatches, 
 Summary | Full Text:PDF