Keyword : free-material and free-orientation integration

Direct Wafer Bonding Technique Aiming for Free-Material and Free-Orientation Integration of Semiconductor Materials
Yae OKUNO Kazuhisa UOMI Masahiro AOKI Tomonobu TSUCHIYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/05/25
Vol. E80-C  No. 5 ; pp. 682-688
Type of Manuscript:  Special Section PAPER (Special Issue on Photonic Integrated Circuits)
direct wafer bondingfree-material and free-orientation integrationlattice- and orientation-mismatches
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