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IEICE Trans

Myunghwan RYU

TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC
Hung Viet NGUYEN Myunghwan RYU Youngmin KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/12/01
Vol. E95-C  No. 12  pp. 1864-1871
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D IC, TSV (Through Silicon Via), power, delay, optimization, interconnect, repeater, 
 Summary | Full Text:PDF