Contribution of Polished Surface Waviness to Final SOI Thickness Uniformity of Bonded Wafers through PACE Process Kiyoshi MITANIMasatake NAKANOTakao ABE
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1997/03/25 Vol. E80-CNo. 3pp. 370-377 Type of Manuscript: INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies) Category: Wafer Technologies Keyword: surface waviness, PACE, SOI thickness uniformity, polishing, PSD,
C-V Measurement and Simulation of Silicon-Insulator-Silicon (SIS) Structures for Analyzing Charges in Buried Oxides of Bonded SOI Materials Kiyoshi MITANIHisham Z. MASSOUD