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IEICE Trans

Kenichi MARUHASHI

Millimeter-Wave Flip-Chip MMIC Structure with High Performance and High Reliability Interconnects
Masaharu ITO Kenichi MARUHASHI Hideki KUSAMITSU Yoshiaki MORISHITA Keiichi OHATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11  pp. 2038-2043
Type of Manuscript:  Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
flip-chip bonding, millimeter wave, electromagnetic simulation, MMIC, low noise amplifier, coplanar waveguide, 
 Summary | Full Text:PDF