Keyword : flip-chip bonding


Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices
Sang-Baie SHIN Ko-Ichiro IIJIMA Hiroshi OKADA Sho IWAYAMA Akihiro WAKAHARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/05/01
Vol. E95-C  No. 5 ; pp. 898-903
Type of Manuscript:  Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category: 
Keyword: 
opto-electronic integrated circuitmicro-LEDflip-chip bondingGaN LED arrays
 Summary | Full Text:PDF

Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI Hiroshi OGURA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2029-2037
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
millimeter waveflip-chip bondingstud bumpmicro bumpBCBmulti-layer
 Summary | Full Text:PDF

Millimeter-Wave Flip-Chip MMIC Structure with High Performance and High Reliability Interconnects
Masaharu ITO Kenichi MARUHASHI Hideki KUSAMITSU Yoshiaki MORISHITA Keiichi OHATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2038-2043
Type of Manuscript:  Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
flip-chip bondingmillimeter waveelectromagnetic simulationMMIClow noise amplifiercoplanar waveguide
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2 ; pp. 370-378
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform
Tomoaki KATO Jun-ichi SASAKI Tsuyoshi SHIMODA Hiroshi HATAKEYAMA Takemasa TAMANUKI Shotaro KITAMURA Masayuki YAMAGUCHI Tatsuya SASAKI Keiro KOMATSU Mitsuhiro KITAMURA Masataka ITOH 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2 ; pp. 305-312
Type of Manuscript:  INVITED PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Photonic Switching Devices
Keyword: 
hybrid photonic integrationsemiconductor optical amplifierplanar lightwave circuitoptical gate switchflip-chip bondingspot-size conversionoptical switchingphotonic ATM switchoptical fiber communicationoptical network
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2 ; pp. 422-430
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform
Tomoaki KATO Jun-ichi SASAKI Tsuyoshi SHIMODA Hiroshi HATAKEYAMA Takemasa TAMANUKI Shotaro KITAMURA Masayuki YAMAGUCHI Tatsuya SASAKI Keiro KOMATSU Mitsuhiro KITAMURA Masataka ITOH 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2 ; pp. 357-364
Type of Manuscript:  INVITED PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Photonic Switching Devices
Keyword: 
hybrid photonic integrationsemiconductor optical amplifierplanar lightwave circuitoptical gate switchflip-chip bondingspot-size conversionoptical switchingphotonic ATM switchoptical fiber communicationoptical network
 Summary | Full Text:PDF