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Hirokazu YONEZAWA

A Modeling Methodology and Body Effect Analysis for Hot-Carrier Reliability Simulation of Logic Circuits Norio KOIKE Hirokazu YONEZAWA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2002/06/01 Vol. E85-C No. 6 pp. 1356-1366 Type of Manuscript: PAPER Category: Integrated Electronics Keyword: hot carrier, secondary hot electron, simulation,
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