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IEICE Trans

Daisuke CHINO

Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals
Eiji HIGURASHI Daisuke CHINO Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C  No. 2  pp. 247-251
Type of Manuscript:  Special Section PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
solder bumping, AuSn, plasma reflow, hydrogen radicals, solder particles, flux residues, 
 Summary | Full Text:PDF