Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C
No. 2 ;
pp. 247-251
Type of Manuscript:
Special Section PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category:
Keyword:
solder bumping, AuSn, plasma reflow, hydrogen radicals, solder particles, flux residues, |
