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IEICE Trans

Changwook YOON

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network
Hyunjeong PARK Hyungsoo KIM Jun So PAK Changwook YOON Kyoungchoul KOO Joungho KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/04/01
Vol. E91-C  No. 4  pp. 595-606
Type of Manuscript:  PAPER
Category: Electromagnetic Theory
Keyword: 
co-modeling, hierarchical power distribution network (PDN), chip and package, 
 Summary | Full Text:PDF