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IEICE Trans

Keyword : system-in-a-package

Superconnect Technology
Takayasu SAKURAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1709-1716
Type of Manuscript:  INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
system-on-a-chip, system-in-a-package, superconnect, RC delay, interconnect, 
 Summary | Full Text:PDF