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IEICE Trans

Keyword : planar packaging system

Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems
Tohru KISHIMOTO Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/10/25
Vol. E81-C  No. 10 ; pp. 1639-1647
Type of Manuscript:  PAPER
Category: Components
Keyword: 
ATM switching system, card-on-board packaging, planar packaging system, forced air cooling, thermal resistance, 
 Summary | Full Text:PDF