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IEICE Trans

Keyword : passive element

Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate
Yasutoshi KURIHARA Tsuneo ENDOH 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/03/25
Vol. E81-C  No. 3 ; pp. 439-446
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
reliability, Sn-Sb solder, insulated metal substrate, Si chip, passive element, 
 Summary | Full Text:PDF