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IEICE Trans

Keyword : packaging technology

Packaging Technology Trends and Challenges for System-in-Package
Akihiro DOHYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1756-1762
Type of Manuscript:  INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
packaging technology, system-in-package, SIP, SoC, CSP, 
 Summary | Full Text:PDF