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IEICE Trans

Keyword : package modeling

Signal Integrity Study of a Panel Level Package Based on Simulation-Measurement Correlations
Sangkyu KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2026/03/01
Vol. E109-C  No. 3 ; pp. 84-92
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
PLP interposer, HDI substrate, package modeling, signal integrity, return loss, TDR, 
 Summary | Full Text:PDF