Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2005/08/01 Vol. E88-CNo. 8 ;
pp. 1620-1628 Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--) Category: Relays and Switches Keyword: electromechanical devices, telecom- and signal relays, lead free soldering, reliability, mixed assemblies,
Impact of Lead Free Soldering Processes on the Reliability of Electromechanical Switching Devices Werner JOHLER
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2004/08/01 Vol. E87-CNo. 8 ;
pp. 1225-1234 Type of Manuscript: Special Section PAPER (Special Section on IS-EMD2003--Recent Technical Trend of Electro-Mechanical Devices) Category: New Technology and Automotive Applications Keyword: electromechanical devices, telecom- and signal relays, lead free soldering, reliability, mixed assemblies,