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IEICE Trans

Keyword : fluxless bonding

3-D Highly Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
Jong-Min KIM Kiyokazu YASUDA Young-Eui SHIN Kozo FUJIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2002/07/01
Vol. E85-C  No. 7 ; pp. 1491-1498
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3-D assembly, fluxless bonding, joint geometry, passive alignment, OE-MCMs, 
 Summary | Full Text:PDF