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IEICE Trans

Keyword : flip-chip assembly

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging
Takuya WADATSUMI Kohei KAWAI Rikuu HASEGAWA Kikuo MURAMATSU Hiromu HASEGAWA Takuya SAWADA Takahito FUKUSHIMA Hisashi KONDO Takuji MIKI Makoto NAGATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2023/10/01
Vol. E106-C  No. 10 ; pp. 556-564
Type of Manuscript:  Special Section PAPER (Special Section on Analog Circuits and Their Application Technologies)
Category: 
Keyword: 
electrostatic discharge, full-wave simulation, on-chip monitor, flip-chip assembly, integrated circuit, 
 Summary | Full Text:PDF