Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2003/03/01 Vol. E86-CNo. 3 ;
pp. 421-426 Type of Manuscript: INVITED PAPER (Special Issue on the 2002 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'02)) Category: Keyword: electromigration, diffuse interface model, grid adaptation, void evolution, finite element method,