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IEICE Trans

Keyword : copper interconnects

Characterizing Film Quality and Electromigration Resistance of Giant-Grain Copper Interconnects
Takahisa NITTA Tadahiro OHMI Tsukasa HOSHI Toshiyuki TAKEWAKI Tadashi SHIBATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/04/25
Vol. E76-C  No. 4 ; pp. 626-634
Type of Manuscript:  Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies)
Category: Process Technology
Keyword: 
copper interconnects, giant-grain, electromigration, low-kinetic-energy ion bombardment process, 
 Summary | Full Text:PDF