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IEICE Trans

Keyword : agile integration

Prospective Silicon Applications and Technologies in 2025
Koji KAI Minoru FUJISHIMA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2011/04/01
Vol. E94-C  No. 4 ; pp. 386-393
Type of Manuscript:  INVITED PAPER (Special Section on Circuits and Design Techniques for Advanced Large Scale Integration)
Category: 
Keyword: 
microcube chip, agile integration, inch-fab, 
 Summary | Full Text:PDF